DocumentCode
1654541
Title
Impact of TSV area on the dynamic range and frame rate performance of 3D-integrated image sensors
Author
Xhakoni, Adi ; Bello, David San Segundo ; Gielen, Georges
Author_Institution
Dept. Elektrotech. ESAT- MICAS, K.U. Leuven, Leuven, Belgium
fYear
2012
Firstpage
836
Lastpage
839
Abstract
This paper introduces a 3D-integrated image sensor with high dynamic range, high frame rate and high resolution capabilities. A robust algorithm for dynamic range extension with low sensitivity to circuit non-idealities and based on multiple exposures is presented. The impact of the TSV diameter over the dynamic range and frame rate performance is studied allowing the choice of the best 3D technology for the required performance.
Keywords
CMOS image sensors; image resolution; three-dimensional integrated circuits; 3D technology; 3D-integrated image sensor; TSV area; TSV diameter; circuit nonidealities; dynamic range extension; frame rate performance; high resolution capability; robust algorithm; CMOS image sensors; Capacitors; Dynamic range; Signal to noise ratio; Through-silicon vias; 3D integration; CMOS image sensor; high dynamic range; high frame rate;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Automation & Test in Europe Conference & Exhibition (DATE), 2012
Conference_Location
Dresden
ISSN
1530-1591
Print_ISBN
978-1-4577-2145-8
Type
conf
DOI
10.1109/DATE.2012.6176611
Filename
6176611
Link To Document