• DocumentCode
    1661531
  • Title

    A 1.2V 30nm 1.6Gb/s/pin 4Gb LPDDR3 SDRAM with input skew calibration and enhanced control scheme

  • Author

    Bae, Yong-Cheol ; Park, Joon-Young ; Rhee, Sang Jae ; Ko, Seung Bum ; Jeong, Yonggwon ; Noh, Kwang-Sook ; Son, XYounghoon ; Youn, Jaeyoun ; Chu, Yonggyu ; Cho, Hyunyoon ; Kim, Mijo ; Yim, Daesik ; Kim, Hyo-Chang ; Jung, Sang-Hoon ; Choi, Hye-In ; Yim, Sun

  • Author_Institution
    Samsung Electron., Hwasung, South Korea
  • fYear
    2012
  • Firstpage
    44
  • Lastpage
    46
  • Abstract
    Mobile DRAM is widely adopted in battery-powered portable devices because of its low power. Recently, in mobile devices such as smart phones and tablet PCs, higher performance is required to support 3D gaming mode and high-quality video. These trends lead to consideration of higher-performance DRAMs than LPDDR2, while the power budget for DRAMs for mobile devices cannot increase. DRAMs with wide I/O or serial I/O have been reviewed as candidates for over 6.4GB/s channel bandwidth. However, wide-I/O DRAMs [1] must solve issues such as stacking yield for higher density and failure analysis modeling of system-in-package (SiP), and most serial I/Os have worse I/O power efficiency than LPDDR2. For an evolutionary successor of LPDDR2, therefore, we design a 1.2V 1.6Gb/s/pin ×32 4Gb low-power DDR3 SDRAM (LPDDR3) with input skew calibration and enhanced refresh control schemes, achieving 6.4GB/s total data bandwidth. Most features of LPDDR3 are backward compatible with LPDDR2, except that channel termination, command-address (CA) training, and write leveling are adopted.
  • Keywords
    DRAM chips; low-power electronics; system-in-package; 3D gaming mode; I/O power efficiency; LPDDR3 SDRAM; SiP; battery-powered portable device; bit rate 6.4 Gbit/s; channel bandwidth; channel termination; command-address training; enhanced refresh control scheme; failure analysis modeling; high-quality video; higher-performance DRAM; input skew calibration; low-power DDR3 SDRAM; mobile DRAM; mobile device; power budget; serial I/O DRAM; size 30 nm; smart phone; stacking yield; storage capacity 4 Gbit; system-in-package; tablet PC; voltage 1.2 V; wide-I/O DRAM; write leveling; Computer architecture; Multiplexing; SDRAM; Temperature sensors; Timing; Training;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2012 IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0193-6530
  • Print_ISBN
    978-1-4673-0376-7
  • Type

    conf

  • DOI
    10.1109/ISSCC.2012.6176871
  • Filename
    6176871