DocumentCode
166180
Title
Energy Introspector: A parallel, composable framework for integrated power-reliability-thermal modeling for multicore architectures
Author
Song, William J. ; Mukhopadhyay, Saibal ; Yalamanchili, Sudhakar
Author_Institution
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2014
fDate
23-25 March 2014
Firstpage
143
Lastpage
144
Abstract
Sustaining processor performance growth is challenged by physical limitations due to increased power and heat dissipations. Power and thermal management techniques combined with inherent workload dynamics create the spatiotemporal variations of power, temperature, and degradation in processors. As industry moves to smaller feature sizes, the performance will become increasingly dominated by the physics. The challenge is in understanding how the physics is manifested at the microarchitecture level. This requires the modeling and simulation environment that can capture multiple, distinct physical phenomena and their concurrent impact on the microarchitecture.
Keywords
integrated circuit packaging; integrated circuit reliability; low-power electronics; microprocessor chips; multiprocessing systems; thermal management (packaging); energy introspector; integrated power-reliability-thermal modeling; multicore architectures; power management technique; thermal management technique; Computational modeling; Computer architecture; Data models; Integrated circuit modeling; Libraries; Microarchitecture; Reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Performance Analysis of Systems and Software (ISPASS), 2014 IEEE International Symposium on
Conference_Location
Monterey, CA
Print_ISBN
978-1-4799-3604-5
Type
conf
DOI
10.1109/ISPASS.2014.6844476
Filename
6844476
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