• DocumentCode
    166180
  • Title

    Energy Introspector: A parallel, composable framework for integrated power-reliability-thermal modeling for multicore architectures

  • Author

    Song, William J. ; Mukhopadhyay, Saibal ; Yalamanchili, Sudhakar

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2014
  • fDate
    23-25 March 2014
  • Firstpage
    143
  • Lastpage
    144
  • Abstract
    Sustaining processor performance growth is challenged by physical limitations due to increased power and heat dissipations. Power and thermal management techniques combined with inherent workload dynamics create the spatiotemporal variations of power, temperature, and degradation in processors. As industry moves to smaller feature sizes, the performance will become increasingly dominated by the physics. The challenge is in understanding how the physics is manifested at the microarchitecture level. This requires the modeling and simulation environment that can capture multiple, distinct physical phenomena and their concurrent impact on the microarchitecture.
  • Keywords
    integrated circuit packaging; integrated circuit reliability; low-power electronics; microprocessor chips; multiprocessing systems; thermal management (packaging); energy introspector; integrated power-reliability-thermal modeling; multicore architectures; power management technique; thermal management technique; Computational modeling; Computer architecture; Data models; Integrated circuit modeling; Libraries; Microarchitecture; Reliability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Performance Analysis of Systems and Software (ISPASS), 2014 IEEE International Symposium on
  • Conference_Location
    Monterey, CA
  • Print_ISBN
    978-1-4799-3604-5
  • Type

    conf

  • DOI
    10.1109/ISPASS.2014.6844476
  • Filename
    6844476