DocumentCode
1661928
Title
Error-tolerance
Author
Breuer, Melvin A.
fYear
2004
Firstpage
3
Abstract
Summary form only given. Because of trends in scaling, in the near future every high performance dice can contain a massive number of defects and process aggravated noise and performance problems. In an attempt to obtain useful yields, designers and test engineers need to adopt a qualitatively different approach to their work. They need to learn, enhance and deploy techniques such as fault- and defect-tolerance. For some applications, they may even apply error-tolerance, a somewhat controversial emerging paradigm. A circuit is error-tolerant (ET) with respect to an application, if (1) it contains defects that cause internal and may cause external errors, and (2) the system that incorporates this circuit produces acceptable results. In this presentation we illustrate and give quantitative bounds on several factors that shape the future of digital design. We compare and contrast defect and fault-tolerant schemes with that of error-tolerance. We discuss how yield can be optimized by appropriately selecting the granularity of spares in light of defect densities and interconnect complexity. Finally, we show that several large classes of consumer electronic applications are resilient to errors, and how error-tolerance can then be used to significantly enhance effective yield.
Keywords
circuit complexity; consumer electronics; integrated circuit interconnections; integrated circuit reliability; integrated circuit yield; consumer electronics; defect density; digital design; error tolerance; integrated circuit yield; interconnect complexity; Application software; Automatic testing; Circuit faults; Circuit testing; Computer errors; Computer science; Design automation; Design engineering; Digital systems; System testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Design: VLSI in Computers and Processors, 2004. ICCD 2004. Proceedings. IEEE International Conference on
ISSN
1063-6404
Print_ISBN
0-7695-2231-9
Type
conf
DOI
10.1109/ICCD.2004.1347888
Filename
1347888
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