• DocumentCode
    1661972
  • Title

    Overall Technological Results of IMS-EFSOT Japanese Project --- Environmental Impact of Lead-Free Soldering ---

  • Author

    Okamoto, Masahide ; Serizawa, Koji ; Satoh, Hiroshi ; Chiba, Momoko ; Takamatsu, Takejiro ; Itsubo, Norihiro ; Inaba, Atsushi

  • Author_Institution
    Production Eng. Res. Lab., Hitachi Ltd., Ibaraki
  • fYear
    2005
  • Firstpage
    554
  • Lastpage
    558
  • Abstract
    As for lead-free solder, jointability (workability and joint reliability) is not only evaluated but also energy consumption i.e. CO 2 emission, toxicity, resource depletion, recyclability and reusability of various types of solder. Next it is attempted to integrate the environmental impacts of these factors of each solder and compare them among these solders. Finally some types of solder whose integrated environmental impact was assumed to be relatively low is recommended. Sn-Ag-Cu and Sn-Cu types of solder as the best solutions in the present state is recommended. That is, total environmental impact of these solders is minimum, although they have a problem of Ag and Sn scarce. Then, suggested it was necessary to construct recycling system of Ag and Sn in the long term. 2nd Selection was Sn-Zn(-Bi) type solder. This solder has only problem about jointability. If this problem should be solved by improvement, this solder would be one of the best selections of lead-free solder. Furthermore refraining from use of Sb containing solder and In containing solder because of their toxicity and scarce respectively is proposed
  • Keywords
    bismuth alloys; carbon compounds; copper alloys; energy conservation; environmental factors; recycling; reliability; silver alloys; soldering; solders; tin alloys; workability; CO2; CO2 emission; IMS-EFSOT Japanese project; SnAgCu; SnCu; SnZnBi; energy consumption; environmental impact; joint reliability; jointability; lead-free soldering; recycling system; resource depletion; scarce; solder recyclability; solder reusability; toxicity; workability; Animals; Bismuth; Electronic waste; Environmentally friendly manufacturing techniques; Lead; Recycling; Research and development; Soldering; Testing; Tin; LCA; LIME; environmental impact; lead-free solder; recycle; scarce; toxicity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Environmentally Conscious Design and Inverse Manufacturing, 2005. Eco Design 2005. Fourth International Symposium on
  • Conference_Location
    Tokyo
  • Print_ISBN
    1-4244-0081-3
  • Type

    conf

  • DOI
    10.1109/ECODIM.2005.1619293
  • Filename
    1619293