A Novel Approach to Disassembly of Joined Interface

Author

Hosoda, Naoe ; Suga, Tadatomo

fYear

2005

Firstpage

592

Lastpage

593

Abstract

This paper presents a new method of joint disassembly using a liquid metal. Liquid gallium was used as a release material to separate an interface joined metallurgically. The surface activated bonding method was used to create a strait interface for penetration path of gallium. This separation method was successfully demonstrated in the case of the joint parts of aluminum-aluminum, aluminum-sapphire, aluminum thin film wire-gold bump and soldered chip on the printed circuit board. The joints were separated easily by penetration of gallium atoms. The surface bonding method was an effective bonding method for separation using liquid gallium

Keywords

bonding processes; design for disassembly; gallium; liquid metal embrittlement; separation; LSI chip; aluminum; joined interface disassembly; liquid gallium; liquid metal embrittlement; separation method; solder; strait interface; surface bonding method; Aluminum; Bonding; Gold; Inorganic materials; Joining materials; Large scale integration; Printed circuits; Silicon; Substrates; Thin film circuits; Disassembly; LSI chip; aluminum; gallium; joint; liquid metal embrittlement; solder;

fLanguage

English

Publisher

ieee

Conference_Titel

Environmentally Conscious Design and Inverse Manufacturing, 2005. Eco Design 2005. Fourth International Symposium on

Conference_Location

Tokyo

Print_ISBN

1-4244-0081-3

Type

conf

DOI

10.1109/ECODIM.2005.1619304

Filename

1619304