DocumentCode
1662689
Title
Analytical approach of saturation voltage instability in high-speed IGBT
Author
Kaneda, Mitsuru ; Tadokoro, Chihiro ; Kiyoi, Akira ; Kusunoki, Shigeru ; Kurokawa, Hiroshi
Author_Institution
Mitsubishi Electr. Corp., Fukuoka, Japan
fYear
2009
Firstpage
1
Lastpage
10
Abstract
A High speed IGBT utilizing an Electron Beam (EB) irradiation and a post annealing process for a carrier lifetime control for a thick n-drift layer has been developed for industry applications, and home appliance especially in the very small chip size to achieve a low cost and a minimizing a size requirements. Even under the extremely high current density of around a half order of higher than the conventional usage for long-time production life, stability of both a saturation voltage VCE(sat), on state forward voltage drop, and a turn off losses Eoff are needed from a reliability point of view. We investigated dependences on the carrier lifetime control processes and a conduction current stress condition by both the IGBT electrical characteristics stability, i.e. for ward out put I-V characteristics, switching characteristics, threshold voltage, and leakage current, and a physical analysis using the Cathode Luminescence (CL) method. And we confirmed that shifts of electrical characteristics are very slight without any problem to use in the relatively high current density operation. Only for the acceleration case, an obvious CL spectrum change can be observed and to be assigned each trap level.
Keywords
insulated gate bipolar transistors; power semiconductor devices; semiconductor device reliability; carrier lifetime control; cathode luminescence method; conduction current stress condition; electron beam irradiation; forward output I-V characteristics; high-speed IGBT; leakage current; saturation voltage instability; switching characteristics; threshold voltage; Annealing; Charge carrier lifetime; Current density; Electric variables; Electron beams; Industry applications; Insulated gate bipolar transistors; Size control; Thickness control; Voltage; Device characterization; IGBT; Reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics and Applications, 2009. EPE '09. 13th European Conference on
Conference_Location
Barcelona
Print_ISBN
978-1-4244-4432-8
Electronic_ISBN
978-90-75815-13-9
Type
conf
Filename
5278819
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