• DocumentCode
    1662875
  • Title

    Hole mobility in SiGe inversion layers: Dependence on surface orientation, channel direction, and strain

  • Author

    Hsieh, Bing-Fong ; Chang, Shu-Tong ; Lee, Ming-Hong

  • Author_Institution
    Dept. of Electr. Eng., Nat. Chung Hsing Univ., Taichung, Taiwan
  • fYear
    2010
  • Firstpage
    606
  • Lastpage
    607
  • Abstract
    Hole mobility in high Ge-content SiGe inversion layer is measured and simulated by a split C-V method and a quantized k.p method, respectively. For an arbitrary crystallographic surface orientation the two dimensional hole gas subband structure is calculated by solving the 6 × 6 k.p Schrodinger equation self-consistently with the electrostatic potential. Three important scattering mechanisms are included: optical phonon scattering, acoustic phonon scattering and surface roughness scattering. The model parameters are calibrated by matching the measured low-field mobility of SiGe on (001) Si wafers. The calibrated model reproduces our experimental channel mobility measurements for biaxial strain SiGe on (001), (111) and (110) substrates.
  • Keywords
    Ge-Si alloys; MOSFET; Schrodinger equation; crystal orientation; hole mobility; internal stresses; inversion layers; semiconductor materials; substrates; surface roughness; (001) substrate; (110) substrate; (111) substrate; 2D hole gas subband structure; Schrodinger equation; SiGe; SiGe inversion layers; acoustic phonon scattering; biaxial strain; channel direction; channel mobility measurements; crystallographic surface orientation; electrostatic potential; hole mobility; optical phonon scattering; pMOSFET; quantized k.p method; silicon wafers; split C-V method; substrates; surface roughness scattering; Acoustic scattering; Capacitive sensors; Electrostatic measurements; Germanium silicon alloys; Optical scattering; Phonons; Rough surfaces; Semiconductor device modeling; Silicon germanium; Surface roughness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanoelectronics Conference (INEC), 2010 3rd International
  • Conference_Location
    Hong Kong
  • Print_ISBN
    978-1-4244-3543-2
  • Electronic_ISBN
    978-1-4244-3544-9
  • Type

    conf

  • DOI
    10.1109/INEC.2010.5424749
  • Filename
    5424749