• DocumentCode
    166291
  • Title

    Stochastic modeling of high-speed data links with nonlinear dynamic terminations

  • Author

    Manfredi, Paolo ; Stievano, Igor Simone ; Vande Ginste, Dries ; De Zutter, Daniel ; Canavero, Flavio G.

  • Author_Institution
    Dept. of Electron. & Telecommun., Politec. di Torino, Turin, Italy
  • fYear
    2014
  • fDate
    11-14 May 2014
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper addresses the statistical modeling and simulation of high-speed interconnects with uncertain physical properties and nonlinear dynamical terminations. The proposed approach is based on the expansion of voltage and current variables in terms of orthogonal polynomials of random variables. It extends the available literature results on the generation of an augmented deterministic SPICE equivalent of the stochastic link to the case in which the terminations are nonlinear and dynamical, like those modeling IC buffers. A single and standard SPICE simulation of the aforementioned equivalent circuit allows to efficiently compute the expansion coefficients that provide statistical information pertinent to the interconnect response. The feasibility and strength of the approach are demonstrated by means of a coupled microstrip interconnect with drivers and receivers.
  • Keywords
    SPICE; integrated circuit interconnections; integrated circuit modelling; microstrip circuits; IC buffer modeling; augmented deterministic SPICE equivalent; coupled microstrip interconnect; current variable; equivalent circuit; high-speed data links; high-speed interconnect; nonlinear dynamic terminations; orthogonal polynomials; random variable; stochastic modeling; voltage variable; Integrated circuit interconnections; Integrated circuit modeling; Mathematical model; Polynomials; Standards; Stochastic processes; Circuit simulation; SPICE; nonlinear; polynomial chaos; signal integrity; statistical analysis; transmission lines;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal and Power Integrity (SPI), 2014 IEEE 18th Workshop on
  • Conference_Location
    Ghent
  • Type

    conf

  • DOI
    10.1109/SaPIW.2014.6844541
  • Filename
    6844541