• DocumentCode
    166309
  • Title

    Combined circuit/full-wave simulations for electromagnetic immunity studies based on an extended S-parameter formulation

  • Author

    Drogoudis, D. ; Van Hese, J. ; Boesman, B. ; Pissoort, Davy

  • Author_Institution
    Agilent Technol., Sint-Denijs-Westrem, Belgium
  • fYear
    2014
  • fDate
    11-14 May 2014
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper describes an extended S-parameter formulation for electronic subcomponents (printed circuit boards, integrated circuits,...) which includes both the regular S-parameter description between the circuit ports of the subcomponent as well as an extra column/row characterizing the coupling between the circuit ports and outgoing/incoming plane waves. The advantage of this extended S-parameter model is that it can be easily integrated into regular circuit simulators and connected to complex linear or non-linear circuitry. This allows to study both Electro-Magnetic Emission and Immunity phenomena in full detail. In this paper, the extended S-parameter model is specifically applied to the study of Electro-Magnetic Immunity problems. In a first example, the influence of an incoming plane wave on the eye diagram of a differential pair is studied. In a second example, the extended S-parameter formulation is combined with a behavioral model of an integrated circuit in order to characterize the radiated immunity of the integrated circuit.
  • Keywords
    S-parameters; electromagnetic interference; integrated circuit modelling; circuit port coupling; circuit simulator; combined circuit-full wave simulations; electromagnetic emission; electromagnetic immunity; electronic subcomponent; extended S-parameter formulation; extended S-parameter model; integrated circuit immunity; Couplings; Integrated circuit modeling; Microstrip; Ports (Computers); Scattering parameters; Transmission line matrix methods; Electro-Magnetic Immunity; extended S-parameters; integrated circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal and Power Integrity (SPI), 2014 IEEE 18th Workshop on
  • Conference_Location
    Ghent
  • Type

    conf

  • DOI
    10.1109/SaPIW.2014.6844551
  • Filename
    6844551