Application of multi-wall carbon nanotube/SiC composite to thermal dissipation of high-bright light emitting diode

Author

Li, Bing-Jing ; Chang, Chih-Hsiang ; Su, Yan-Kuin ; Gan, Kwang-Jow ; Hong, Jia-Wei

Author_Institution

Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan

fYear

2010

Firstpage

56

Lastpage

58

Abstract

A novel CNT/SiC/epoxy composite was proposed and demonstrated as adhesive joining element and heat dissipation media for HB-LEDs. Junction temperature, luminous intensity and forward voltage were measured for varied combinations in the composites. The experimental results showed that the epoxy with 30 wt% of SiC and 5 wt% of MWCNTs had the best thermal properties. Comparing to commercial epoxy, the CNT/SiC/ epoxy could decrease junction temperature from 123°C to 93°C and thermal resistance from 81°C /W to 65°C/W.

Keywords

adhesive bonding; adhesives; carbon nanotubes; cooling; intensity measurement; light emitting diodes; nanocomposites; silicon compounds; temperature measurement; thermal resistance; voltage measurement; C-SiC; CNT-SiC-epoxy composite; HB-LED; MWCNT; adhesive joining element; forward voltage measurement; heat dissipation media; high-bright light emitting diode; junction temperature; luminous intensity; multiwall carbon nanotube-SiC composite; thermal dissipation; thermal resistance; Doping; Light emitting diodes; Silicon carbide; carbon nanotube; high-power light emitting diode; junction temperature; thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Next-Generation Electronics (ISNE), 2010 International Symposium on

Conference_Location

Kaohsiung

Print_ISBN

978-1-4244-6693-1

Type

conf

DOI

10.1109/ISNE.2010.5669200

Filename

5669200