DocumentCode
1666395
Title
DBC Technology for Extremely Thin Flat Heat Pipes
Author
Kamenova, L. ; Avenas, Y. ; Schaeffer, C. ; Kapelski, G. ; Tzanova, S. ; Schulz-Harder, J.
Author_Institution
INPG St.-Martin-d´Heres, Paris
fYear
2007
Firstpage
1412
Lastpage
1418
Abstract
This paper presents the conception and the experimental procedures of flat copper heat pipe embedded in extremely thin 3D packaging substrates. Since conventional machining for this application is very complicated and expensive, the DBC (Directed Bonded Copper) technology proved to be more interesting for mass production. The experimental results demonstrated that the DBC heat pipe is an excellent solution to enhance the heat transfer within the 3D packaging.
Keywords
heat pipes; heat transfer; integrated circuit bonding; integrated circuit packaging; machining; 3D packaging substrates; conventional machining; directed bonded copper technology; heat pipes; heat transfer; Bonding; Conducting materials; Copper; Electronic packaging thermal management; Heat sinks; Heat transfer; Space technology; Thermal conductivity; Thermal management; Thermal management of electronics;
fLanguage
English
Publisher
ieee
Conference_Titel
Industry Applications Conference, 2007. 42nd IAS Annual Meeting. Conference Record of the 2007 IEEE
Conference_Location
New Orleans, LA
ISSN
0197-2618
Print_ISBN
978-1-4244-1259-4
Type
conf
DOI
10.1109/07IAS.2007.218
Filename
4347967
Link To Document