Fabrication of bottom die substrate solderless interconnection based on nano copper wires

Direct copper bonded (DBC) bottom die substrate attachment is usually ensured by solder joints but with regard to reliability it remains the weakest component of the package. The sustained trend for high power density requires new interconnection technologies. Nanowires seem to be a promising candidate for interconnection applications in power electronics and microelectronics. This paper presents the fabrication process of an innovative solderless interconnection based on copper nano-wires by electroplating process, itself using the anodic aluminum oxide (AAO) template. Some mechanical and electrical characterizations are investigated in order to evaluate this interconnection technology.