Title :
Wireless RF design challenges
Author_Institution :
Motorola Inc., Austin, TX, USA
Abstract :
The challenges and opportunities for the RF designer have perhaps never been greater. The drive to higher levels of integration in the extremely competitive cellular chipset market place; the emergence of new wireless communications links such as Bluetooth and WLAN; and the continual need to provide multi-band, multi-mode, multiservice, modulation independent, cost effective transceivers have all produced a great demand for RF design skills. This paper discusses the markets, system level specifications, and RF design challenges.
Keywords :
3G mobile communication; Bluetooth; cellular radio; digital video broadcasting; radio access networks; radio links; transceivers; wireless LAN; 3G; Bluetooth; RF circuit integration; RF semiconductor design; RF system level specifications; WLAN; cellular chipset market place; cellular phones; digital video broadcasting; multi-band/multi-mode/multi-service/modulation independent transceivers; wireless RF design challenges; wireless communications links; Bluetooth; Cellular phones; GSM; Global Positioning System; Ground penetrating radar; Multiaccess communication; Radio frequency; Semiconductor device manufacture; Wireless LAN; Wireless communication;
Conference_Titel :
Radio Frequency Integrated Circuits (RFIC) Symposium, 2003 IEEE
Print_ISBN :
0-7803-7694-3
DOI :
10.1109/RFIC.2003.1213881
