Title :
Membrane probe technology for MCM Known-Good-Die
Author :
Ueno, Toshiaki ; Kondoh, You
Author_Institution :
Hewlett-Packard Labs., Kanagawa, Japan
Abstract :
A new type of membrane probe, which might be called a Universal Membrane Probe (UMP), as a standard Known-Good-Die (KGD) solution for Multichip Module (MCM) manufacture is described. The membrane consists of TAB tape mounted with an array of several thousands micro-bumps. The bumps are connected in a radial pattern and the pitch of the bumps is equal to the pitch of the I/O pads in LSIs. The advantage of this new membrane is that a single wiring pattern is applicable to many die designs without the need for customizing. In this paper, two KGD applications of the new membrane are investigated, one is a wafer probe and the other a burn-in socket
Keywords :
electric sensing devices; integrated circuit manufacture; integrated circuit testing; multichip modules; probes; DC performance; HF performance; LSI; MCM Known-Good-Die; Multichip Module; TAB tape; Universal Membrane Probe; burn-in socket; cost; die designs; leakage current; membrane probe technology; micro-bumps; pitch; radial pattern; single wiring pattern; wafer probe; Assembly; Biomembranes; Costs; Laboratories; Manufacturing; Packaging; Probes; Sockets; Testing; Wiring;
Conference_Titel :
Test Conference, 1994. Proceedings., International
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-2103-0
DOI :
10.1109/TEST.1994.527932
