DocumentCode
167589
Title
HMC-Sim: A Simulation Framework for Hybrid Memory Cube Devices
Author
Leidel, John D. ; Yong Chen
Author_Institution
Dept. of Comput. Sci., Texas Tech Univ., Lubbock, TX, USA
fYear
2014
fDate
19-23 May 2014
Firstpage
1465
Lastpage
1474
Abstract
The recent advent of stacked die memory and logic technologies has lead to a resurgence in research associated with fundamental architectural techniques. Many architecture research projects begin with ample simulation of the target theoretical functions and approach. However, the logical and physical nature three-dimensional stacked devices, such as the Hybrid Memory Cube (HMC) specification, fundamentally do not align with traditional memory simulation techniques. As such, there currently exists a chasm in the capabilities of modern architectural simulation frameworks. This work introduces a new simulation framework developed specifically for the Hybrid Memory Cube specification. We present a set of novel techniques implemented on an associated development framework that provide an infrastructure to flexibly simulate one or more Hybrid Memory Cube stacked die memory devices attached to an arbitrary core processor. The goal of this development infrastructure is to provide architectural simulation frameworks the ability to begin migrating current banked DRAM memory models to stacked HMC-based designs without a reduction in simulation fidelity or functionality. In addition to the core simulation architecture, this work also presents a series of memory workload test results using the infrastructure that elicit device, vault and bank utilization trace data from within a theoretical device. These evaluations have confirmed that HMC-Sim can provide insightful guidance in designing and developing highly efficient systems, algorithms, and applications, considering the next-generation three-dimensional stacked memory devices. HMC-Sim is currently open source, licensed under a BSD-style license and is freely available to the community.
Keywords
DRAM chips; memory architecture; BSD-style license; HMC specification; HMC-Sim; HMC-based designs; arbitrary core processor; architectural techniques; architecture research projects; bank utilization trace data; banked DRAM memory models; core simulation architecture; hybrid memory cube devices; hybrid memory cube specification; logic technologies; memory simulation techniques; memory workload test; next-generation three-dimensional stacked memory devices; physical nature three-dimensional stacked devices; stacked die memory; target theoretical functions; Bandwidth; Memory management; Performance evaluation; Random access memory; Software; Topology; Hybrid Memory Cube; computer simulation; memory architecture; memory management;
fLanguage
English
Publisher
ieee
Conference_Titel
Parallel & Distributed Processing Symposium Workshops (IPDPSW), 2014 IEEE International
Conference_Location
Phoenix, AZ
Print_ISBN
978-1-4799-4117-9
Type
conf
DOI
10.1109/IPDPSW.2014.164
Filename
6969550
Link To Document