• DocumentCode
    16768
  • Title

    Chip-Level Simultaneous Switching Current Measurement in Power Distribution Network Using Magnetically Coupled Embedded Current Probing Structure

  • Author

    Kim, J.J. ; Changhyun Cho ; Bumhee Bae ; Sukjin Kim ; Sunkyu Kong ; Heegon Kim ; Jung, D.H. ; Jiseong Kim ; Joungho Kim

  • Author_Institution
    Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
  • Volume
    4
  • Issue
    12
  • fYear
    2014
  • fDate
    Dec. 2014
  • Firstpage
    1963
  • Lastpage
    1972
  • Abstract
    A simultaneous switching current (SSC) drawn by an integrated circuit (IC) creates simultaneous switching noise on power nets, which in turn causes jitters in the I/O signals and reduces the maximum clock frequency. For a thorough analysis of high-speed ICs, there is a dire need to measure currents at specific power pins of the ICs. In this paper, a novel magnetically coupled embedded current probing structure is proposed for measuring the SSC on the chip level resulting from the logical activity of the I/O buffers. SSCs are found by capturing the magnetic flux induced by the SSC of interest, with the proposed embedded current probing structure using magnetic coupling, and then reconstructing the original current waveform using the transfer impedance profile. Through a series of measurements with test vehicles fabricated on the chip level, we experimentally verified the proposed probing structures in the time and frequency domains and proved that they can effectively measure the SSC. Finally, future directions for improvements are discussed at the end of this paper.
  • Keywords
    electric current measurement; integrated circuit interconnections; integrated circuit measurement; jitter; time-frequency analysis; I-O signals; SSC; current waveform; frequency domains; high-speed IC; integrated circuit; jitters; magnetic coupling; magnetic flux; magnetically coupled embedded current probing structure; maximum clock frequency; power nets; simultaneous switching current; simultaneous switching noise; time domains; transfer impedance profile; Coils; Current measurement; Embedded systems; Magnetic flux; Probes; Switching circuits; Chip level; current waveform reconstruction; embedded current probing structures; magnetic coupling; simultaneous switching current (SSC); simultaneous switching noise (SSN); simultaneous switching noise (SSN).;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2014.2362130
  • Filename
    6939626