DocumentCode
1678093
Title
Using TMR Architectures for SoC Yield Improvement
Author
Vial, J. ; Virazel, A. ; Bosio, A. ; Dilillo, L. ; Girard, P. ; Landrault, C. ; Pravossoudovitch, S.
Author_Institution
Lab. d´´Inf., Univ. de Montpellier, Montpellier, France
fYear
2009
Firstpage
155
Lastpage
160
Abstract
Manufacturing processes in the nanoscale era are less and less reliable thus leading to lower and lower yields. To address this problem during SoC development, memory cores are built with hardware redundancies. On the other hand, logic cores embedded in SoC usually do not have these main capabilities. Therefore, manufacturing defects affecting these cores decrease the yield of the entire SoC. Consequently, meaningful techniques for SoC yield improvement must also consider logic cores. In this paper, we propose and investigate the usage of TMR architectures for logic cores to increase the overall SoC yield. We also propose a solution to improve the fault tolerance of TMR architectures. Results obtained on SoC examples (ISCASpsila85 and ITCpsila99 benchmark circuits as logic cores merged with memory cores at different rates) demonstrate the interest of using TMR architectures for logic cores for SoC yield enhancement.
Keywords
fault tolerance; system-on-chip; ISCASpsila85; ITCpsila99; SoC yield improvement; TMR Architectures; benchmark circuits; fault tolerance; logic cores; manufacturing processes; memory cores; Computer errors; Fault tolerance; Hardware; Logic arrays; Logic circuits; Logic testing; Manufacturing processes; Redundancy; Silicon; System testing; Fault tolerance; Logic cores; SoC; TMR architectures; manufacturing defects; yield;
fLanguage
English
Publisher
ieee
Conference_Titel
Advances in System Testing and Validation Lifecycle, 2009. VALID '09. First International Conference on
Conference_Location
Porto
Print_ISBN
978-1-4244-4862-3
Electronic_ISBN
978-0-7695-3774-0
Type
conf
DOI
10.1109/VALID.2009.26
Filename
5279407
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