• DocumentCode
    1678093
  • Title

    Using TMR Architectures for SoC Yield Improvement

  • Author

    Vial, J. ; Virazel, A. ; Bosio, A. ; Dilillo, L. ; Girard, P. ; Landrault, C. ; Pravossoudovitch, S.

  • Author_Institution
    Lab. d´´Inf., Univ. de Montpellier, Montpellier, France
  • fYear
    2009
  • Firstpage
    155
  • Lastpage
    160
  • Abstract
    Manufacturing processes in the nanoscale era are less and less reliable thus leading to lower and lower yields. To address this problem during SoC development, memory cores are built with hardware redundancies. On the other hand, logic cores embedded in SoC usually do not have these main capabilities. Therefore, manufacturing defects affecting these cores decrease the yield of the entire SoC. Consequently, meaningful techniques for SoC yield improvement must also consider logic cores. In this paper, we propose and investigate the usage of TMR architectures for logic cores to increase the overall SoC yield. We also propose a solution to improve the fault tolerance of TMR architectures. Results obtained on SoC examples (ISCASpsila85 and ITCpsila99 benchmark circuits as logic cores merged with memory cores at different rates) demonstrate the interest of using TMR architectures for logic cores for SoC yield enhancement.
  • Keywords
    fault tolerance; system-on-chip; ISCASpsila85; ITCpsila99; SoC yield improvement; TMR Architectures; benchmark circuits; fault tolerance; logic cores; manufacturing processes; memory cores; Computer errors; Fault tolerance; Hardware; Logic arrays; Logic circuits; Logic testing; Manufacturing processes; Redundancy; Silicon; System testing; Fault tolerance; Logic cores; SoC; TMR architectures; manufacturing defects; yield;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advances in System Testing and Validation Lifecycle, 2009. VALID '09. First International Conference on
  • Conference_Location
    Porto
  • Print_ISBN
    978-1-4244-4862-3
  • Electronic_ISBN
    978-0-7695-3774-0
  • Type

    conf

  • DOI
    10.1109/VALID.2009.26
  • Filename
    5279407