Title :
Thermal design considerations in the design and application of DC-DC converters
Author :
Walker, Anthony D. ; Williams, David
Author_Institution :
Power Trends Inc., Batavia, IL, USA
Abstract :
Power densities and power supply components have improved such that the major obstacle in using DC-DC converters is effectively removing the heat from these devices. This paper shows practical and theoretical heat removal issues through conduction, natural convection and forced air convection. Thermal resistance and its applications are discussed. Thermal derating and how it applies to the converter is also discussed
Keywords :
DC-DC power convertors; forced convection; heat sinks; natural convection; packaging; thermal analysis; thermal resistance; DC-DC converter packaging; conduction; forced air convection; heat removal; heat sinks; natural convection; power densities; power supply components; thermal derating; thermal design; thermal resistance; DC-DC power converters; Electronic packaging thermal management; Heat transfer; Integrated circuit packaging; Printed circuits; Pulse width modulation; Pulse width modulation converters; Temperature sensors; Thermal conductivity; Thermal resistance;
Conference_Titel :
Applied Power Electronics Conference and Exposition, 1996. APEC '96. Conference Proceedings 1996., Eleventh Annual
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-3044-7
DOI :
10.1109/APEC.1996.500558
