DocumentCode
1686303
Title
Estimation of heat transfer coefficient temperature dependence from cooling curve measurements
Author
Czerwoniec, Andrzej ; Torzewicz, Tomasz ; Samson, Agnieszka ; Janicki, Marcin
Author_Institution
Dept. of Microelectron. & Comput. Sci., Lodz Univ. of Technol., Lodz, Poland
fYear
2015
Firstpage
422
Lastpage
425
Abstract
This paper discusses on the practical example of a power diode attached to a heat sink the problem of heat transfer coefficient temperature dependence and its importance for free convection cooled electronic systems. The average values of this coefficient are estimated from multiple measurements of device cooling curves performed for different device heating currents. These values are used then for transient simulations of the device with compact thermal models.
Keywords
cooling; heat sinks; power semiconductor diodes; thermal management (packaging); convection cooled electronic systems; cooling curve measurements; device cooling curve; heat sink; heat transfer; power diode; Heat transfer; Mathematical model; Resistance heating; Temperature measurement; Thermal resistance; compact thermal models; free convection cooling;
fLanguage
English
Publisher
ieee
Conference_Titel
Mixed Design of Integrated Circuits & Systems (MIXDES), 2015 22nd International Conference
Conference_Location
Torun
Print_ISBN
978-8-3635-7806-0
Type
conf
DOI
10.1109/MIXDES.2015.7208555
Filename
7208555
Link To Document