Title :
The research of thickness measurement to thin materials by ultrasonic amplitude spectra
Author :
Qin Lei Sun ; Ai Hua Li ; Mei Quan Liu ; Xiao Gang Han
Author_Institution :
Shijiazhuang Mech. Eng. Coll., Shijiazhuang, China
Abstract :
It´s difficult to distinguish the echo superimposed signal between Thin layer interface up and down when measuring thickness by ultrasonic method. In order to solve this problem, ultrasonic signal processing methods is used to extract characterization of thickness, and the high-precision thickness of thin layer material is realized. This method overcomes the defects that can´t separate superposition using traditional echo method.
Keywords :
acoustic signal processing; echo; thickness measurement; ultrasonic materials testing; ultrasonic measurement; echo superimposed signal; thickness measurement; thin layer interface; thin layer material; ultrasonic amplitude spectra; ultrasonic signal processing method; Biomedical measurement; Materials; Surface acoustic waves; Surface impedance; Thickness measurement; Ultrasonic variables measurement; thickness measurement; thin materials; ultrasonic amplitude spectra;
Conference_Titel :
Applied Superconductivity and Electromagnetic Devices (ASEMD), 2013 IEEE International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4799-0068-8
DOI :
10.1109/ASEMD.2013.6780820