• DocumentCode
    1689680
  • Title

    High-Speed Flex Chip-to-Chip Interconnect

  • Author

    Braunisch, Henning ; Jaussi, James E. ; Mix, Jason A.

  • Author_Institution
    Intel Corp., Chandler, AZ
  • fYear
    2006
  • Firstpage
    273
  • Lastpage
    276
  • Abstract
    Signaling rates up to 20 Gb/s on a flex-circuit chip-to-chip interconnect are reported in active testing based on 90-nm CMOS circuits. The characterization of two flex connector prototypes demonstrates their basic durability and good high-frequency performance
  • Keywords
    CMOS integrated circuits; flexible electronics; high-speed integrated circuits; integrated circuit interconnections; integrated circuit testing; 90 nm; CMOS circuits; active testing; flex connector; high-speed flex chip-to-chip interconnect; signaling rates; Backplanes; CMOS technology; Circuit testing; Connectors; Packaging; Prototypes; Sockets; Substrates; TV; USA Councils;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2006 IEEE
  • Conference_Location
    Scottsdale, AZ
  • Print_ISBN
    1-4244-0668-4
  • Type

    conf

  • DOI
    10.1109/EPEP.2006.321153
  • Filename
    4115407
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1689680