• DocumentCode
    16917
  • Title

    Introducing Mutual Heating Effects in the Ladder-Type Soil Model for the Dynamic Thermal Rating of Underground Cables

  • Author

    Diaz-Aguilo, Marc ; de Leon, Francisco

  • Author_Institution
    Dept. of Electr. & Comput. Eng., New York Univ., New York, NY, USA
  • Volume
    30
  • Issue
    4
  • fYear
    2015
  • fDate
    Aug. 2015
  • Firstpage
    1958
  • Lastpage
    1964
  • Abstract
    The proper modeling of the transient thermal behavior of mutual heating effects between underground power cables is very important for the rating of transmission and distribution cables. The IEC standards proposed an accurate model based on exponential integrals that it can be difficult to implement in basic electrical software. The model is not consistent with the layered modeling of the cable thermal resistances. In this paper, a simple and easy-to-use alternative model is presented. It consists of injecting the correct current at the right position of the RC circuit representing the soil. The new model can accurately reproduce the full physics of the transient phenomenon and is consistent with the modeling of the cable used in the IEC standards themselves. The new model is tested and validated against numerous finite-element simulations for realistic cable installations.
  • Keywords
    IEC standards; finite element analysis; power cables; soil; thermal resistance; underground cables; IEC standard; RC circuit; distribution cable thermal resistance; finite element simulation; ladder-type soil model; mutual heating effects transient thermal behavior; transient phenomenon; transmission cable; underground power cable dynamic thermal rating; Computational modeling; Heating; Integrated circuit modeling; Mathematical model; Power cables; Soil; Transient analysis; Mutual heating; power system measurement; power systems; real-time thermal rating; thermal modeling; underground cables;
  • fLanguage
    English
  • Journal_Title
    Power Delivery, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0885-8977
  • Type

    jour

  • DOI
    10.1109/TPWRD.2015.2390072
  • Filename
    7008559