Title :
Advantages of process modeling as a key manufacturing tool to improve process efficiency and reduce costs
Author :
Adzima, J.C. ; Elazar, S. ; Ketchie, W.D. ; Riordan, W.J. ; Anjard, R.P.
Author_Institution :
General Dynamics, San Diego, CA, USA
Abstract :
The authors describe the utilization of simulation techniques to achieve significant manufacturing improvements for a typical DoD circuit card manufacturing facility. Although the information presented describes the process flow of printed wire boards through the manufacturing cycle it can be used for improving any process-oriented system. Also included is information on selecting the proper hardware and software for various environments, data requirements, locating and processing this data, setting up and manipulating the various simulation parameters, type of output, proper output analysis, applications to other situations, validation techniques, and actual results showing a 90% reduction of work in process and a 83% reduction in cycle time. The authors describe in detail the approach to use for implementation in any aerospace environment or similar business dealing with small demand requirements of a high product mix
Keywords :
digital simulation; printed circuit manufacture; process control; production control; DoD circuit card manufacturing facility; WIP reduction; aerospace environment; computer modelling; cost reduction; cycle time reduction; high product mix; implementation; key manufacturing tool; manufacturing cycle; manufacturing improvements; printed wire boards; process efficiency; process flow; process modeling; process-oriented system; reduction of work in process; simulation techniques; small demand requirements; Aerodynamics; Application software; Assembly; Circuit simulation; Computational modeling; Computer simulation; Costs; Manufacturing processes; Production facilities; Virtual manufacturing;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1991., Eleventh IEEE/CHMT International
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-0155-2
DOI :
10.1109/IEMT.1991.279756