Title :
Automated assembly of new 3D molded interconnection devices
Author :
Feldmann, K. ; Franke, J.
Author_Institution :
Inst. for Manuf. Autom. & Production Syst., Erlangen, Germany
Abstract :
It is pointed out that the assembly of electronic devices is determined by separate construction of flat printed circuit boards with discrete components and insertion in a mechanical unit. New opportunities of integrating housing and circuitry by means of molded interconnects result in new challenges of the insertion technique. Thus, future application-specific industrial robots have to insert components into a housing with three-dimensional circuitry. This also requires new concepts for adhering and soldering. Furthermore, new interconnection technologies have to be included in circuitry structure. The integration of chip on board and multichip techniques require extended insertion systems. The development and testing of these assembly concepts are described
Keywords :
assembling; industrial robots; printed circuit manufacture; soldering; 3D molded interconnection devices; adhering; application-specific industrial robots; automated assembly; chip on board; discrete components; flat printed circuit boards; insertion technique; multichip techniques; soldering; Assembly systems; Conducting materials; Consumer electronics; Electronic equipment; Electronic equipment manufacture; Integrated circuit interconnections; Printed circuits; Production systems; Robotic assembly; Soldering;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1991., Eleventh IEEE/CHMT International
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-0155-2
DOI :
10.1109/IEMT.1991.279805
