DocumentCode
1693403
Title
3.125 Gbps × 8 channels parallel interconnection module with low height MT receptacle connector for single mode fibers
Author
Iwase, M. ; Shirai, T. ; Ishikawa, Y. ; Nomura, T. ; Izawa, A. ; Mori, H. ; Shimoji, N. ; Shiino, M. ; Yuguchi, R.
Author_Institution
Furukawa Electr. Co. Ltd., Chiba, Japan
fYear
2002
fDate
6/24/1905 12:00:00 AM
Firstpage
292
Lastpage
299
Abstract
An eight channel optical parallel transmitter/receiver module, for the optical parallel interconnection over VSR (Very Short Reach), which consists of an optical sub assembly (OSA), lead frame package with an IC on the heat spreader and newly designed low height receptacle was demonstrated. Using single mode fiber provided low skew and low height dimension of the receptacle system which is suitable for application to the small pitch between the printed circuit boards in a system rack of the equipment. To reduce the distortion of the signal and crosstalk between the channels, the microstrip line structure consisted of polyimide material and thin metal layers applied in the optical subassembly. Transmission bit rate as high as 3.125 Gbps/ch are achieved.
Keywords
data communication equipment; digital communication; integrated optoelectronics; modules; optical fibre couplers; optical interconnections; optical receivers; optical transmitters; packaging; printed circuit accessories; 3.125 Gbit/s; PCB interconnection; crosstalk reduction; distortion reduction; eight channel configuration; heat spreader; lead frame package; low height MT receptacle connector; microstrip line structure; multi-fiber connector; optical sub-assembly; optical transmitter/receiver module; parallel interconnection module; polyimide material; printed circuit boards; single mode fiber; system rack PCBs; Assembly; Connectors; Integrated circuit interconnections; Integrated circuit packaging; Optical crosstalk; Optical distortion; Optical fiber devices; Optical interconnections; Optical receivers; Optical transmitters;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
ISSN
0569-5503
Print_ISBN
0-7803-7430-4
Type
conf
DOI
10.1109/ECTC.2002.1008110
Filename
1008110
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