Title :
Integrated 5.7 GH size antenna for wireless sensor networks
Author :
Mendes, P.M. ; Polyakov, A. ; Bartek, M. ; Burghartz, J.N. ; Correia, J.H.
Author_Institution :
Dept. of Ind. Electron., Minho Univ., Guimaraes, Portugal
Abstract :
We report on design, fabrication and characterization of chip-size antennas for operation at 5.7 GHz and use in wireless sensor networks. Application of wafer-level chip-scale packaging (WLCSP) techniques like adhesive wafer bonding and through-wafer electrical via formation, combined with the selected antenna types (patch and folded patch) allows on-chip integration and is the main novelty of our work. A short-range wireless link between two systems both equipped with an 8/spl times/8 mm/sup 2/ patch antenna (measured characteristics: 5.705 GHz central frequency, 90 MHz bandwidth @ -10 dB, 0.3 dB gain, 18 % efficiency) realized on a high-resistivity silicon (HRS) substrate is demonstrated. A folded-patch antenna built on two stacked glass substrates allows size reduction down to 4.5/spl times/4/spl times/1 mm/sup 3/ and has a projected efficiency of 60%.
Keywords :
HF antennas; chip scale packaging; elemental semiconductors; microstrip antennas; silicon; substrates; wireless sensor networks; -10 dB; 0.3 dB; 5.705 GHz; Si; adhesive wafer bonding; chip-size antennas; folded-patch antenna; high-resistivity silicon substrates; integrated antenna; on-chip integration; stacked glass substrates; wafer-level chip-scale packaging; wireless sensor; Antenna measurements; Bandwidth; Chip scale packaging; Fabrication; Frequency measurement; Gain measurement; Patch antennas; Wafer bonding; Wafer scale integration; Wireless sensor networks;
Conference_Titel :
TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-7731-1
DOI :
10.1109/SENSOR.2003.1215250
