Title :
Connector interconnections to transmission lines for 40 Gb/s broadband applications
Author :
Lyons, Alan M. ; Becker, Andrew J. ; Lee, Youngmin ; Metz, Carsten ; Shih, Shih-En ; Auernhammer, P. ; Weisser, Stefan
Author_Institution :
Lucent Technol. Bell Labs., Murray Hill, NJ, USA
fDate :
6/24/1905 12:00:00 AM
Abstract :
The electrical performance of Sub-Miniature Coaxial Connector (SMCC) interconnections to transmission lines was investigated in a frequency range up to 50 GHz. A family of test coupons was built to evaluate the following design parameters of SMCC connector interfaces: transmission line structures, solder pad shapes and structures, SMCC connector structures and grounding of the SMCC housing. Electromagnetic 3D full-wave solver (HFSS) was used not only to elucidate the main design factors affecting the electrical performance of the interconnection but also to compare between model results and measured S-parameters. Low-loss SMCC interconnections to well designed Grounded Co-Planar Waveguide (GCPW) and microstrip transmission lines were achieved without significant resonances up to a frequency range of 50 GHz. Grounding between the SMCC connector housing and bottom ground plane of the transmission line was found to be the most critical factor for electrical loss. Transmission line design and connector structure details were also found to have a significant impact on performance.
Keywords :
S-parameters; coaxial cables; coplanar waveguides; earthing; electric connectors; finite element analysis; interconnections; losses; microstrip lines; millimetre wave devices; 40 Gbit/s; 50 GHz; EM 3D full-wave solver; HFSS; S-parameters; connector design; connector grounding; connector housing; connector structures; design parameters evaluation; electrical loss; electrical performance; grounded CPW; low-loss interconnections; microstrip transmission lines; solder pad shapes; sub-miniature coaxial connector interconnections; test coupons; transmission line structures; Coaxial components; Connectors; Coplanar transmission lines; Electromagnetic modeling; Frequency; Grounding; Shape; Testing; Transmission line measurements; Transmission lines;
Conference_Titel :
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
Print_ISBN :
0-7803-7430-4
DOI :
10.1109/ECTC.2002.1008227