DocumentCode
1696776
Title
Efficient simulation of chip-to-chip interconnect system by combining waveform relaxation with reduced-order modeling methods
Author
Beyene, Wendemagegnehu T.
Author_Institution
Rambus Inc., Los Altos, CA, USA
fYear
2002
fDate
6/24/1905 12:00:00 AM
Firstpage
1045
Lastpage
1050
Abstract
A new method is proposed for an efficient transient analysis of an interconnect-dominated system with a large number of linear, lumped and distributed elements and few nonlinear driver and termination networks. The method is based on partitioning the system into linear and nonlinear subnetworks and solving each subsystem iteratively using waveform relaxation technique. This allows a suitable and efficient simulation technique to be applied on each subnetwork. The linear network is analyzed using a reduced-order-modeling technique in the frequency domain and the time-domain waveforms are obtained using the inverse Laplace transform relation and reclusive convolution in the absence of the nonlinear networks. The method improves the simulation speed and accuracy because smaller nonlinear circuits are solved using conventional simulation methods. The technique and the validity of the method are discussed with an example using the Rambus memory channel.
Keywords
Laplace transforms; circuit simulation; equivalent circuits; integrated circuit interconnections; iterative methods; linear network analysis; nonlinear network analysis; reduced order systems; transient analysis; Ranibus memory channel; chip-to-chip interconnect system; frequency domain; inverse Laplace transform relation; linear subnetworks; nonlinear subnetworks; partitioning; reclusive convolution; reduced order-modeling technique; simulation technique; time-domain waveforms; transient analysis; waveform relaxation technique; Analytical models; Circuit simulation; Communication channels; Dielectric losses; Driver circuits; Frequency domain analysis; Integrated circuit interconnections; Nonlinear circuits; Time domain analysis; Transient analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
ISSN
0569-5503
Print_ISBN
0-7803-7430-4
Type
conf
DOI
10.1109/ECTC.2002.1008231
Filename
1008231
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