3D integration with PCB technology

The future of 3D integration and packaging of power electronics using printed circuit board (PCB) technology is presented. This is to show how power electronics can benefit from the same advantages that have been exploited by the microelectronic industry, for some time already, regarding high density packaging, as implemented in modern digital photo and video cameras for example. Complementary technologies, enhancing the role of the printed circuit board from mere electrical interconnect medium to means to perform electromagnetic integration of passives, using specialised laminate material; to perform volumetric optimisation, using flexible foil; and to perform thermal management, using existing material and volume; are investigated as well as the specific material and technology limitations being faced by design engineers today. The investigation lead to a PCB assembled power converter implementing electromagnetic integration of passives, a flexible foil integrated-LCT winding realisation as well as a novel 3D-folding packaging method to obtain increased power density. The impact which the exploitation of these combined technologies introduce has been quantified using recently developed performance indicators, from which a critical look on aspects of improvement is possible. Experimental validation of the presented performance indicators are performed by means of a technology demonstrator. The design criteria and technology choices for this demonstrator, based on planar core-, in combination with flexible foil winding realisation technology, are also addressed.