• DocumentCode
    1697643
  • Title

    Measure the thickness of the thin-film single-slice-capacitor

  • Author

    Changhui Liu ; Le Liu ; He, Huahui

  • Author_Institution
    Sch. of Comput. Sci. & Eng., Wuhan Inst. of Technol., Wuhan
  • fYear
    2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    According to wave-absorbing materialpsilas electricity characteristic, this text created a kind of new high-performance, low-cost capacitance type absorbing-wave coatpsilas thickness measuring system. Carry out a research of thin film measurement which from nm-level to micron-level. According to the theory which capacitor working in electric field, it design a special single-piece capacitance sensor. This system can carry on a measurement to the thickness of thin film from nm-level to micron-level. Pass to adopt a kind of new capacitance signal to collect the framework type integration chip(Frame ASIC) CAV424 and shield measure and low price position RISC microcontroller, it carries out a method combine with the difference technique and three-signals-inspect technique. The system can automatically adjust null, correct and remove a great deal of errors. Because the microcontroller has inside place 10 position A/D conversion and driver of LCD, the CAV424 outputpsilas differential voltage signal can be directly with the ADC connection, link in the microcontroller, and the structure of system is very simple.
  • Keywords
    analogue-digital conversion; microcontrollers; thickness measurement; thin film capacitors; thin film sensors; A/D conversion; LCD; RISC microcontroller; electric field; electricity; framework type integration chip CAV424; thickness measurement; thin-film single-slice-capacitor; Application specific integrated circuits; Capacitance measurement; Capacitive sensors; Capacitors; Electric variables measurement; Microcontrollers; Semiconductor device measurement; Sensor phenomena and characterization; Thickness measurement; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Automation Congress, 2008. WAC 2008. World
  • Conference_Location
    Hawaii, HI
  • Print_ISBN
    978-1-889335-38-4
  • Electronic_ISBN
    978-1-889335-37-7
  • Type

    conf

  • Filename
    4699095