• DocumentCode
    1699115
  • Title

    Circuit solutions on ESD protection design for mixed-voltage I/O buffers in nanoscale CMOS

  • Author

    Ker, Ming-Dou ; Wang, Chang-Tzu

  • Author_Institution
    Inst. of Electron., Nat. Chiao-Tung Univ., Hsinchu, Taiwan
  • fYear
    2009
  • Firstpage
    689
  • Lastpage
    696
  • Abstract
    Electrostatic discharge (ESD) protection for mixed-voltage I/O interfaces has been one of the major challenges of system-on-a-chip (SOC) implementation in nanoscale CMOS processes. Moreover, the gate leakage current across thin gate-oxide devices has serious degradation on circuit performance while circuits implementing in nanoscale CMOS processes. The on-chip ESD protection circuit for mixed-voltage I/O buffers should meet the gate-oxide reliability constraints and be designed with consideration of gate leakage current. This paper presents the effective ESD protection scheme with circuit solutions to protect the mixed-voltage I/O buffers in nanoscale CMOS processes against ESD stresses. The proposed ESD protection scheme and the specific ESD clamp circuits with low standby leakage current have been successfully verified in nanoscale CMOS processes. Effective on-chip ESD protection scheme should be early planed and started in the beginning phase of chip design in order to achieve good enough ESD robustness for IC products.
  • Keywords
    CMOS integrated circuits; electrostatic discharge; nanoelectronics; system-on-chip; ESD protection design; circuit solutions; electrostatic discharge protection; mixed-voltage I/O buffers; mixed-voltage I/O interfaces; nanoscale CMOS; system-on-a-chip; CMOS process; Circuit optimization; Clamps; Degradation; Electrostatic discharge; Leakage current; Nanoscale devices; Protection; Stress; System-on-a-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference, 2009. CICC '09. IEEE
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4244-4071-9
  • Electronic_ISBN
    978-1-4244-4073-3
  • Type

    conf

  • DOI
    10.1109/CICC.2009.5280728
  • Filename
    5280728