• DocumentCode
    1699487
  • Title

    Academia-industry collaboration in SoC design education: wishes and reality

  • Author

    Mashiko, K. ; Kanuma, A. ; Kozawa, T. ; Kiwon Lee ; Wu, Aimin ; Zhihua Wang

  • Author_Institution
    Semicond. Technol. Acad. Res. Center, Japan
  • fYear
    2004
  • Firstpage
    18
  • Lastpage
    21
  • Abstract
    The complexity of IC has been growing each year, now reaching nano-scale design rule and over billion transistors on a chip. To develop advanced SoCs, huge amount and high quality of resources and research activities are necessary for design as well as for technology development. It is getting even more vital to recruit well-trained students, who can lead the global competition. Industry is also expecting for universities to help raise probability of success of SoCs, the market of which is even more limited in time-to-market and product life in spite of the huge investment. These are the major motivations, for which SoC industry wishes to share resources and risk with universities. Industry has even established consortiums to improve and activate the relationship with universities toward these goals. In this panel, views from universities and industry are discussed and analyzed to explore successful collaboration.
  • Keywords
    educational institutions; electronic engineering education; further education; innovation management; integrated circuit design; investment; research initiatives; system-on-chip; time to market; SoC design education; academia-industry collaboration; advanced SoC; global competition; potential conflicts; product development; product life; research activities; time-to-market; Collaboration; Collaborative work; Consumer electronics; Educational products; Government; Industrial control; Industrial relations; Moore´s Law; Product development; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced System Integrated Circuits 2004. Proceedings of 2004 IEEE Asia-Pacific Conference on
  • Print_ISBN
    0-7803-8637-X
  • Type

    conf

  • DOI
    10.1109/APASIC.2004.1349391
  • Filename
    1349391