DocumentCode
1700519
Title
Moving signals on and off chip
Author
Rosenbaum, Elyse ; Hyeon-Min Bae ; Bhatia, K.S. ; Faust, A.C.
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
fYear
2009
Firstpage
585
Lastpage
592
Abstract
Today, signals being transmitted on and off chip have frequency spectra extending to 10 GHz and beyond. The parasitic impedance associated with the package and ESD protection circuit can distort a signal and must be carefully managed. An overview of methods for parasitic impedance mitigation and codesign is provided.
Keywords
distortion; electrostatic discharge; integrated circuit design; integrated circuit packaging; integrated circuit reliability; I/O circuit topology; IC codesign; chip package; frequency spectra; on and off chip; on-chip ESD protection circuit; parasitic impedance mitigation; signal distortion; signal transmission; Bonding; Electrostatic discharge; Frequency; Impedance; Inductance; Integrated circuit packaging; Pins; Protection; Reflection; Wires; ESD; IO;
fLanguage
English
Publisher
ieee
Conference_Titel
Custom Integrated Circuits Conference, 2009. CICC '09. IEEE
Conference_Location
San Jose, CA
Print_ISBN
978-1-4244-4071-9
Electronic_ISBN
978-1-4244-4073-3
Type
conf
DOI
10.1109/CICC.2009.5280774
Filename
5280774
Link To Document