DocumentCode
1701210
Title
30 GHz Litz wires defined by ion track lithography
Author
Lindeberg, M. ; Ojefors, E. ; Rydberg, A. ; Hjort, Klas
Author_Institution
Div. of Mater. Sci., Uppsala Univ., Sweden
Volume
1
fYear
2003
Firstpage
887
Abstract
We have demonstrated the ability to combine microsystem technologies with sub-micron wire fabrication in polyimide based flexible printed circuitry board (PCB) laminates. Clusters of sub-micron wires in each via enables that no increase of resistance is shown for copper wires up to 30 GHz. A toroidal inductor is fabricated as an example of the application of ultra-high density via interconnects.
Keywords
copper; interconnections; ion beam lithography; laminates; micromechanical devices; polymers; printed circuits; wires; 30 GHz; Cu; Litz wires; PCB laminates; copper wires; ion track lithography; microsystem technologies; polyimide based flexible printed circuitry board laminates; resistance; submicron wire fabrication; Fabrication; Flexible printed circuits; Frequency; Immune system; Integrated circuit interconnections; Lithography; Microwave filters; Polyimides; Substrates; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003
Conference_Location
Boston, MA, USA
Print_ISBN
0-7803-7731-1
Type
conf
DOI
10.1109/SENSOR.2003.1215617
Filename
1215617
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