DocumentCode
1701577
Title
Wire sizing considering skin effect for high frequency circuits
Author
Nagano, Yoshihiro ; Cao, Yuri ; Tsukizoe, Akira
Author_Institution
Graduate Sch. of Inf. Sci. & Electr. Eng., Kyushu Univ., Japan
fYear
2004
Firstpage
282
Lastpage
285
Abstract
This paper proposes wire sizing considering skin effect. Previous work on wire sizing usually uses RC model which is independent of frequency. However, as increasing operating frequency, frequency-dependence of interconnect characteristics is becoming significant. Therefore, in interconnect design and analysis, frequency-dependence must be considered. By wire sizing considering frequency-dependence, the experimental results show about 50% ∼ 80% reduction of effective upper-bound wire width compared with previous work.
Keywords
SPICE; circuit layout CAD; crosstalk; integrated circuit layout; large scale integration; network routing; skin effect; HSPICE; LSI design; clock wires; crowd routing area; effective upper-bound wire width; frequency-dependence; global interconnects; high frequency circuits; interconnect design; signal buses; skin effect; wire sizing; Circuits; Clocks; Conductors; Crosstalk; Frequency; Inductance; Large scale integration; Signal design; Skin effect; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced System Integrated Circuits 2004. Proceedings of 2004 IEEE Asia-Pacific Conference on
Print_ISBN
0-7803-8637-X
Type
conf
DOI
10.1109/APASIC.2004.1349472
Filename
1349472
Link To Document