• DocumentCode
    1701577
  • Title

    Wire sizing considering skin effect for high frequency circuits

  • Author

    Nagano, Yoshihiro ; Cao, Yuri ; Tsukizoe, Akira

  • Author_Institution
    Graduate Sch. of Inf. Sci. & Electr. Eng., Kyushu Univ., Japan
  • fYear
    2004
  • Firstpage
    282
  • Lastpage
    285
  • Abstract
    This paper proposes wire sizing considering skin effect. Previous work on wire sizing usually uses RC model which is independent of frequency. However, as increasing operating frequency, frequency-dependence of interconnect characteristics is becoming significant. Therefore, in interconnect design and analysis, frequency-dependence must be considered. By wire sizing considering frequency-dependence, the experimental results show about 50% ∼ 80% reduction of effective upper-bound wire width compared with previous work.
  • Keywords
    SPICE; circuit layout CAD; crosstalk; integrated circuit layout; large scale integration; network routing; skin effect; HSPICE; LSI design; clock wires; crowd routing area; effective upper-bound wire width; frequency-dependence; global interconnects; high frequency circuits; interconnect design; signal buses; skin effect; wire sizing; Circuits; Clocks; Conductors; Crosstalk; Frequency; Inductance; Large scale integration; Signal design; Skin effect; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced System Integrated Circuits 2004. Proceedings of 2004 IEEE Asia-Pacific Conference on
  • Print_ISBN
    0-7803-8637-X
  • Type

    conf

  • DOI
    10.1109/APASIC.2004.1349472
  • Filename
    1349472