• DocumentCode
    1701682
  • Title

    3D ICs and 3D systems

  • Author

    Rincon, Ann Marie ; Loke, Alvin

  • Author_Institution
    SMSC, USA
  • fYear
    2009
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    The papers in this session describe a wide variety of novel 3D techniques at the wafer level to the board and system levels.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference, 2009. CICC '09. IEEE
  • Conference_Location
    San Jose, CA, USA
  • Print_ISBN
    978-1-4244-4071-9
  • Electronic_ISBN
    978-1-4244-4073-3
  • Type

    conf

  • DOI
    10.1109/CICC.2009.5280816
  • Filename
    5280816
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1701682