DocumentCode
1703355
Title
Microsensor applications based on doped diamond thin films
Author
Hintermann, H.E.
Author_Institution
CSEM Centre Suisse d´´Electron. de Microtechnique SA, Neuchatel, Switzerland
fYear
1993
fDate
11/4/1993 12:00:00 AM
Firstpage
42552
Lastpage
42556
Abstract
The development of simple diamond based sensors for mass production is reported. To make a diamond film based sensor in micron dimensions a success as an industrial product, it has to be shown, that such sensors can technically and economically be produced in large numbers. For a number of different applications such as mass flow meters, pressure transducers, thermistors, IR-windows and sensing devices, free standing membranes of diamond are required either as support and/or as sensing element. In all these cases the deposition of diamond and p-doped diamond is performed by thermal filament CVD (TF-CVD) or by μ-wave/electron cyclotron resonance-CVD (μ W/ECR-CVD) on wafers of 4" diameter with a coating uniformity of ±5% of the average film thickness. The substrate temperature is kept at all times at 800°C, the filament temperature at 2300°C±100°C when using TF-CVD. These deposition conditions provided a constant and reproducible diamond quality of low impurity (originating from the filament material) as well as of graphite, sp2. The coatings are fairly smooth, with an average roughness, Ra, of 0.1 μm. An integrated gas-flow transducer has been fabricated to demonstrate the feasibility
Keywords
anemometers; diamond; electric sensing devices; elemental semiconductors; flow measurement; micromechanical devices; plasma CVD; pressure transducers; semiconductor thin films; 2300 degC; 4 inches; 800 degC; IR-windows; TF-CVD; average roughness; coating uniformity; diamond film sensor; doped diamond thin films; filament temperature; graphite; integrated gas-flow transducer; mass flow meters; microsensor; mu -wave/electron cyclotron resonance-CVD; mu W/ECR-CVD; p-doped diamond; pressure transducers; semiconductor; sensing devices; substrate temperature; thermal filament CVD; thermistors;
fLanguage
English
Publisher
iet
Conference_Titel
Diamond in Electronics and Optics, IEE Colloquium on
Conference_Location
London
Type
conf
Filename
280356
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