• DocumentCode
    1704058
  • Title

    Realization of perfect silicon corrugated diaphragm using KOH etching

  • Author

    Soin, Orhayati ; Majlis, Burhanuddin Yeop

  • Author_Institution
    Inst. of Microengineering & Nanoelectronics, Universiti Kebangsaan Malaysia, Selangor, Malaysia
  • fYear
    2004
  • Abstract
    This article presents corner compensation mask design in order to realize perfect silicon corrugated diaphragm using KOH etching technique. The corner undercutting of silicon (100) in KOH is quite serious and without compensation it is difficult to construct a complete convex corner structures since the silicon diaphragm is etched from both top and bottom directions in order to form the corrugated structure. The introduction of the additional mask layout for the protection of convex corners at all convex-mask geometry of the corrugated diaphragm during the KOH etching process has been proved by simulation to produce almost perfect square corners.
  • Keywords
    diaphragms; elemental semiconductors; etching; masks; micromachining; micromechanical devices; semiconductor process modelling; silicon; KOH etching technique; Si; convex corner structures; convex-mask geometry; corner compensation mask design; corner undercutting; corrugated diaphragm; Anisotropic magnetoresistance; Delay; Geometry; Micromachining; Nanoelectronics; Protection; Silicon; Solid modeling; Strips; Wet etching;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Electronics, 2004. ICSE 2004. IEEE International Conference on
  • Print_ISBN
    0-7803-8658-2
  • Type

    conf

  • DOI
    10.1109/SMELEC.2004.1620913
  • Filename
    1620913