DocumentCode
1704058
Title
Realization of perfect silicon corrugated diaphragm using KOH etching
Author
Soin, Orhayati ; Majlis, Burhanuddin Yeop
Author_Institution
Inst. of Microengineering & Nanoelectronics, Universiti Kebangsaan Malaysia, Selangor, Malaysia
fYear
2004
Abstract
This article presents corner compensation mask design in order to realize perfect silicon corrugated diaphragm using KOH etching technique. The corner undercutting of silicon (100) in KOH is quite serious and without compensation it is difficult to construct a complete convex corner structures since the silicon diaphragm is etched from both top and bottom directions in order to form the corrugated structure. The introduction of the additional mask layout for the protection of convex corners at all convex-mask geometry of the corrugated diaphragm during the KOH etching process has been proved by simulation to produce almost perfect square corners.
Keywords
diaphragms; elemental semiconductors; etching; masks; micromachining; micromechanical devices; semiconductor process modelling; silicon; KOH etching technique; Si; convex corner structures; convex-mask geometry; corner compensation mask design; corner undercutting; corrugated diaphragm; Anisotropic magnetoresistance; Delay; Geometry; Micromachining; Nanoelectronics; Protection; Silicon; Solid modeling; Strips; Wet etching;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Electronics, 2004. ICSE 2004. IEEE International Conference on
Print_ISBN
0-7803-8658-2
Type
conf
DOI
10.1109/SMELEC.2004.1620913
Filename
1620913
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