Title :
A 4× 25-to-28Gb/s 4.9mW/Gb/s −9.7dBm high-sensitivity optical receiver based on 65nm CMOS for board-to-board interconnects
Author :
Takemoto, T. ; Yamashita, Hiromasa ; Yazaki, Takahiro ; Chujo, Norio ; Yong Lee ; Matsuoka, Yasutaka
Author_Institution :
Hitachi, Tokyo, Japan
Abstract :
Growing data traffic requires low-power 25Gb/s-class optical interconnects for board-to-board transmission inside ICT systems [1-4]. The main power consumption of an optical link strongly depends on the sensitivity of the TIA; thus, development of a high-sensitivity TIA is a key to creating a low-power optical link., There are two challenges concerning the design of such a TIA: (1) improving the sensitivity of TIA without sacrificing bandwidth and (2) suppressing ISI due to insertion loss. To address these two issues, a 4×25Gb/s CMOS optical receiver (RX), which includes a four-channel TIA and a PD array operating at 1.3μm wavelength, is developed. The key components of the TIA are an automatic-decision-threshold control (ATC) with an offset canceller and low-voltage output driver (Drv) with peaking value of 7.7dB at 12.5GHz, achieved by separating equalizer (EQ) function and output buffer (BUF). The TIA attains a sensitivity of -9.7dBm (86μApp) optical modulation amplitude (OMA) and an eye opening of 65% at 25Gb/s. Operation at 28Gb/s with sensitivity of -8.2dBm (121μApp) OMA is also confirmed.
Keywords :
CMOS integrated circuits; integrated optoelectronics; low-power electronics; optical interconnections; optical links; optical modulation; optical receivers; ATC; CMOS optical receiver; ICT systems; ISI suppression; OMA; PD array; automatic-decision-threshold control; bit rate 25 Gbit/s to 28 Gbit/s; board-to-board interconnects; board-to-board transmission; data traffic; equalizer function; frequency 12.5 GHz; high-sensitivity TIA; high-sensitivity optical receiver; insertion loss; low-power optical interconnects; low-power optical link; low-voltage output driver; offset canceller; optical modulation amplitude; output buffer; power consumption; size 65 nm; wavelength 1.3 mum; CMOS integrated circuits; Insertion loss; Noise; Optical receivers; Optical sensors; Propagation losses; Sensitivity;
Conference_Titel :
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2013 IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4673-4515-6
DOI :
10.1109/ISSCC.2013.6487662