DocumentCode
170940
Title
50 mW 220 GHz InP HBT power amplifier MMIC
Author
Radisic, Vesna ; Scott, Dennis W. ; Monier, Cedric
Author_Institution
Northrop Grumman Aerosp. Syst., Redondo Beach, CA, USA
fYear
2014
fDate
1-6 June 2014
Firstpage
1
Lastpage
3
Abstract
In this paper, a 220-235 GHz single-stage power amplifier (PA) MMIC is presented. The amplifier uses 250 nm InP hetero-junction bipolar transistors (HBTs) and benzocyclobutene (BCB) thin-film microstrip technology. Two levels of power combining were used on-chip to achieve total emitter area of 12 μm2. The first level is a two emitter finger HBT with each finger having emitter area of 0.25×6 μm2. The second level is on-chip power combining of four two-finger HBTs in parallel. The amplifier MMIC has 5 dB of small signal gain from 220 to 240 GHz. It has demonstrated saturated output power of 50 mW at 220 and 225 GHz with power-added efficiency (PAE) ≥ 6.7 %. At 231 and 235 GHz, the PA demonstrates saturated output power of 40 mW and PAE ≥ 5.5 %. These are the highest PAE numbers demonstrated at these frequencies.
Keywords
MMIC power amplifiers; heterojunction bipolar transistors; indium compounds; power combiners; thin film circuits; BCB technology; InP; PAE numbers; benzocyclobutene thin-film microstrip technology; frequency 220 GHz to 240 GHz; gain 5 dB; heterojunction bipolar transistors; on-chip power combining; power 40 mW; power 50 mW; power-added efficiency; single-stage power amplifier MMIC; size 250 nm; two emitter finger HBT; Analytical models; Heterojunction bipolar transistors; Impedance; Indium phosphide; MMICs; Radio frequency; Semiconductor device measurement; HBT; Power amplifier; monolithic microwave integrated circuit (MMIC);
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium (IMS), 2014 IEEE MTT-S International
Conference_Location
Tampa, FL
Type
conf
DOI
10.1109/MWSYM.2014.6848257
Filename
6848257
Link To Document