Title :
Evaluation of low stress dielectrics for board application
Author :
Brownlee, Kellee ; Shinotani, K. ; Raj, P. Markondeya ; Bbattacharya, S.K. ; Wong, C.P. ; Tummala, Rao R.
Author_Institution :
Georgia Institute of Technology
Keywords :
Copper; Dielectric liquids; Dielectric materials; Dielectric substrates; Glass; Packaging; Sheet materials; Temperature; Thermal stresses; Thermomechanical processes;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216268