DocumentCode
1712432
Title
Board level reliability of components with matte tin lead finish
Author
Nguyen, L. ; Walberg, R. ; Zhou, L. ; Koh, T.
Author_Institution
National Semiconductor Corp.
fYear
2003
Firstpage
346
Lastpage
352
Keywords
Assembly; Connectors; Electronics packaging; Environmentally friendly manufacturing techniques; Lead compounds; Logistics; Semiconductor device packaging; Soldering; Temperature; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216300
Filename
1216300
Link To Document