Title :
Damage evolution in Sn62Pb36Ag2 solder of a chip scale pacliage under a monotonic shear stress
Author :
Canumalla, S. ; Mathew, S. ; Saha, S.K.
Author_Institution :
Nokia Mobile Phones
Keywords :
Assembly; Capacitive sensors; Chip scale packaging; Creep; Resins; Stress; Surface cracks; Temperature; Testing; Vehicles;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216344
