Title :
A study of new flip chip packaging process for diversified bump and land combination
Author :
Noro, Hiroshi ; Ito, Satoshi ; Kuwamura, Makoto ; Mizutani, Masaki
Author_Institution :
Nitto Denko Corp., Mie, Japan
Abstract :
Flip chip packaging using plastic substrates is gaining popularity in the IC packaging market. However, the process has not been standardized as a real mass production system. We have newly developed a flip chip packaging technology using a nonconductive underfill resin sheet. The process flow of the new flip chip packaging is as follows. First, the underfill sheet is laminated to the substrate. Next, the bumped die is aligned and attached to the substrate, which is covered with the underfill sheet under appropriate heat and pressure conditions. The bumps under the die penetrate by displacing resin and eventually reach the metal land of the substrate. Finally, curing of the underfill sheet and metal connections is done. We have studied the possibility of application of this packaging technology to diversified bump and land combinations with changing underfill components and process parameters. The electrical stability under several stress test conditions such as JEDEC Level-3 and TST has been evaluated in this study. After this evaluation, we found that the packages which were built with the appropriate resin components and process parameters show good performance for all of these reliability tests, almost regardless of bump and land materials
Keywords :
encapsulation; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; laminates; microassembling; plastic packaging; polymer films; stability; IC packaging; JEDEC Level-3 stress test; TST stress test; bump materials; bumped die alignment; bumped die attach; curing; die bump penetration; diversified bump/land combination; electrical stability; flip chip packaging; flip chip packaging process; flip chip packaging technology; heat conditions; land materials; mass production system; metal connections; nonconductive underfill resin sheet; plastic substrates; pressure conditions; process flow; process parameters; reliability tests; resin components; resin displacement; stress test conditions; substrate metal land; underfill components; underfill sheet; underfill sheet-substrate laminate; Curing; Flip chip; Integrated circuit packaging; Mass production; Materials reliability; Plastic integrated circuit packaging; Resins; Stability; Stress; Testing;
Conference_Titel :
IEMT/IMC Symposium, 2nd 1998
Conference_Location :
Tokyo
Print_ISBN :
0-7803-5090-1
DOI :
10.1109/IEMTIM.1998.704533