Title :
Bulk solder and solder joint properties for lead free 95.5Sn-3.8Ag-0.7Cu solder alloy
Author :
Pang, John H L ; Xiong, B.S. ; Neo, C.C. ; Mang, X.R. ; Low, T.H.
Author_Institution :
Nanyang Technological University
Keywords :
Copper; Electronics industry; Environmentally friendly manufacturing techniques; Intermetallic; Lead; Microstructure; Soldering; Temperature; Testing; Tin;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216355
