• DocumentCode
    1713771
  • Title

    Influence of metallic defects on the partial discharges at the interface between epoxy resin and silicone rubber

  • Author

    Onogi, M. ; Ohki, Y. ; Takahashi, Tatsuro ; Takahashi, Tatsuro ; Okamoto, Tatsuaki

  • Author_Institution
    Dept. of Electr. Eng. & Bioscience, Waseda Univ., Tokyo, Japan
  • Volume
    3
  • fYear
    2005
  • Firstpage
    560
  • Abstract
    We have proposed a concept of an all solid insulated substation system as a next generation substation from a viewpoint of environmental protection. In order to make the system compact and its layout flexible, a compact connection system with a soft insulating material and a hard one has to be developed. There is a high possibility that the dielectric strength of such a connection system is decreased when a metallic defect such as a wire exists at its interface. Thus, we prepared samples that imitate the interface of the connection system and measured partial discharge inception voltages (PDIV) in both cases that a metal wire was present or not at the interface. When we put the metal wire along the direction of electric field, the PDIV decreases significantly with an increase in the length of the wire, while it decreases a little when the wire is along the equipotential line. The presence of air at the interface also reduces the PDIV.
  • Keywords
    dielectric materials; electric fields; environmental management; epoxy insulation; partial discharge measurement; silicone rubber; substation insulation; dielectric strength; electric field; environmental protection; epoxy resin; metal wire; metallic defects; partial discharge inception voltages; silicone rubber; solid insulated substation system; Dielectric breakdown; Dielectric materials; Dielectric measurements; Dielectrics and electrical insulation; Epoxy resins; Partial discharges; Rubber; Solids; Substation protection; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulating Materials, 2005. (ISEIM 2005). Proceedings of 2005 International Symposium on
  • Print_ISBN
    4-88686-063-X
  • Type

    conf

  • DOI
    10.1109/ISEIM.2005.193430
  • Filename
    1496234