Title :
Analytical solution for moisture-induced interface delamination in electronic packaging
Author :
Fan, Xuejun ; Zhang, G.Q. ; van Driel, W. ; Ernst, L.J.
Author_Institution :
Philips Research USA
Keywords :
Absorption; Delamination; Electronics packaging; Moisture; Plastics; Polymers; Printed circuits; Semiconductor device packaging; Soldering; Temperature;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216365
