DocumentCode
1715480
Title
Board level reliability of three-dimensional systems in package (SIPs)
Author
Sugiyama, Takuya ; Yano, Yuji ; Ishihara, Sayaka ; Maruyama, Tomoyo ; Juso, Hiroynki ; Kirnura, T. ; Kada, Morihiro
Author_Institution
SHARP Corporation
fYear
2003
Firstpage
1106
Lastpage
1111
Keywords
Application specific integrated circuits; Cameras; Cities and towns; Costs; Integrated circuit packaging; Logic; Mobile handsets; Stacking; Testing; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216429
Filename
1216429
Link To Document