Dynamic and quasi-static three dimensional simulation of wire-looping process in wirebonding

Author

Tay, A.A.O. ; Ng, B.H. ; Ong, S.H.

Author_Institution

National University of Singapore

fYear

2003

Firstpage

1330

Lastpage

1333

Keywords

Analytical models; Bonding processes; Capacitive sensors; Computational modeling; Computer simulation; Gold; Packaging; Probes; Solid modeling; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

ISSN

0569-5503

Print_ISBN

0-7803-7791-5

Type

DOI

10.1109/ECTC.2003.1216467

Filename

1216467

Link To Document